Arrefecedor de CPU DeepCool AK620 12 cm, duas ventoinhas de 120 mm, 6 heatpipes, TDP 260 W, PWM, FDB, altura 160 mm, preto

DeepCool AK620 High Performance CPU Cooler is a dual-tower air cooler with six copper heat pipes and two 120 mm FDB fans, designed to provide strong cooling capacity and low noise for high-performance desktop systems. It features a precision-machined convex copper base and a dense fin array to improve heat transfer and sustain higher clock speeds under load. The cooler supports up to 160 mm height and offers RAM clearance depending on fan configuration.

Advantages

The AK620 delivers up to 260 W heat dissipation capacity and improved airflow for demanding applications. Two 120 mm PWM fans with fluid dynamic bearings provide quiet operation without sacrificing cooling performance. The dual-tower layout and six copper heat pipes increase thermal efficiency, while the machined copper base enhances contact with the CPU for consistent heat transfer. The all-metal mounting kit ensures stable installation on both Intel and AMD platforms.

Key specifications

• Model: DeepCool AK620
• Cooling type: Dual-tower air cooler
• Heat pipes: 6 × copper
• Fans: 2 × 120 mm PWM, fluid dynamic bearing (FDB)
• Maximum heat dissipation: 260 W
• Cooler height: 160 mm
• RAM clearance: 43 mm (59 mm in single-fan configuration)
• Base: Precision-machined convex copper
• Compatibility: Intel and AMD (all-metal mounting kit included)

How to use

Install the AK620 following the included mounting instructions: attach the appropriate backplate and metal brackets for your Intel or AMD socket, position the cooler so the copper base makes full contact with the CPU, secure the towers and fans, and connect the PWM fan headers to the motherboard. If RAM clearance is limited, use a single-fan configuration to achieve up to 59 mm clearance. Verify fan orientation for optimal airflow and configure fan curves in BIOS or software for desired noise and cooling balance.

Recommendations

For best results, apply an even, thin layer of thermal compound between the CPU and the cooler’s copper base, ensure sufficient case airflow to complement the dual-tower design, and check physical clearance in your case and around memory modules before final installation.