Conjunto de pasta térmica Akasa AK-TC01-150GR (1,5g) e almofada térmica AK-TN01-BK (100x100mm)

This bundle from Akasa includes a high-performance thermal compound and a premium thermal pad, providing a complete thermal management solution for CPUs, GPUs, chipsets, VRMs, and SSDs. The thermal compound ensures efficient heat transfer between the processor and heatsink, while the thermal pad offers a convenient, mess-free alternative for components with uneven surfaces.

Advantages

Includes both thermal paste and pad for versatile application. The thermal compound features high thermal conductivity of 3.8 W/mK and a wide operating temperature range. The thermal pad is silicone-based, non-conductive, and easy to cut to size.

Suitable for

• CPU and GPU cooling
• Chipsets and VRMs
• SSD heatsinks
• Any electronic component requiring thermal interface material

Key specifications

• Thermal Compound: AK-TC01-150GR, 1.5g syringe, grey, non-curing paste
• Thermal Conductivity: 3.8 W/mK
• Thermal Pad: AK-TN01-BK, 100x100mm, 1.0mm thick, black, silicone-based
• Thermal Pad Conductivity: 1.5 W/mK
• Operating Temperature: Compound -50°C to 240°C, Pad -40°C to 180°C
• Flammability Rating: UL 94 V-0 (pad)

Recommendations

For best results, clean surfaces thoroughly before application. Use the thermal compound for direct die or IHS contact, and the pad for components with height variations.