Dissipador de calor/Arrefecedor Inter-Tech B-6

The Inter-Tech B-6 processor heatsink/radiator is a compact cooling solution designed for high‑load server and workstation processors. Constructed with copper and silver-coloured elements, the unit measures 90 mm × 90 mm × 27 mm and provides a rated thermal design power (TDP) of 205 W. The heatsink is intended to transfer heat away from the CPU core and maintain stable temperatures under sustained workloads, and it is compatible with LGA 3647 (Socket P) processor platforms.

Advantages

The Inter-Tech B-6 combines a copper-coloured base and silver-coloured fins to support efficient heat conduction and dissipation in a small footprint. With a TDP rating of 205 W and a total weight of 0.42 kg, the heatsink balances cooling capacity and compactness for constrained chassis environments. Its standardized mounting compatibility with LGA 3647 (Socket P) simplifies installation on supported motherboards.

Suitable for

• Server and workstation CPUs using LGA 3647 (Socket P)
• Systems requiring a compact heatsink with high TDP handling
• Enclosures with limited clearance where a low-profile cooler is needed

Key specifications

• Dimensions: 90 mm (W) × 90 mm (D) × 27 mm (H)
• Thermal Design Power (TDP): 205 W
• Supported processor socket: LGA 3647 (Socket P)
• Fan diameter: 0 mm (passive heatsink / no integrated fan)
• Weight: 0.42 kg
• Product colour: Copper colour, Silver

How to use

Install the Inter-Tech B-6 heatsink on a compatible motherboard with an LGA 3647 (Socket P) processor following your motherboard manufacturer’s recommended mounting procedure. Ensure the CPU contact surface and the heatsink base are clean and apply an appropriate thin layer of thermal interface material between the CPU IHS and the heatsink base. Secure the heatsink according to the mounting mechanism until it is evenly seated to ensure reliable thermal contact. Because the product has no integrated fan, confirm that system airflow is sufficient or add case fans as required to maintain optimal cooling.

Recommendations

Use this heatsink in systems where a compact, high‑TDP passive or externally cooled solution is required. Monitor CPU temperatures after installation, verify that chassis airflow meets thermal needs, and reapply thermal interface material according to the CPU and TIM manufacturer guidelines when performing maintenance.