Gembird TG-G3.0-01 pasta térmica 4,5 W/m·K 3 g

Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g

Gembird's TG-G3.0-01 thermal paste provides efficient thermal conductivity with a value of 4.5 W/mK. This product ensures optimal heat transfer for various applications, enhancing the performance of electronic components. With a thermal resistance of 0.205°C/W, it effectively manages heat, allowing systems to operate within safe temperature limits. Operating in extreme temperatures between -50°C and 240°C, this thermal paste is suitable for a wide range of uses, from low-temperature applications to high-performance systems. Compliance with ISO 9002 and RoHS standards ensures safety and quality, making it a reliable choice for thermal management in electronic devices.

Specifications

• Depth: 180 mm
• Height: 15 mm
• Operating temperature (T-T): -50 - 240
• Package depth: 390 mm
• Package height: 280 mm
• Package weight: 3600 g
• Package width: 380 mm
• Product colour: Grey
• Weight: 0.003 kg
• Width: 120 mm
• Thermal conductivity: 4.5 W/m·K
• Viscosity note: 76 CPS
• Thermal resistance: 0.205 °C/W
• RoHS compliance: Yes

Genuine Gembird product — MPN: TG-G3.0-01 · EAN: 8716309083133.