Pad térmico Akasa AK-TT140-01

The Akasa AK-TT140-01 thermal pad is a soft, ceramic-filled silicone pad designed to improve heat transfer between electronic components and heatsinks. It measures 70 mm x 20 mm x 1 mm and is available in blue and green. The pad operates across a wide temperature range from -40 °C to 160 °C, is non-corrosive and electrically non-conductive, and can be cut to fit uneven surfaces to increase contact area and thermal conduction.

Advantages

The ceramic-filled silicone construction provides stability at high and low temperatures without melting, while remaining electrically non-conductive and non-corrosive. The pad conforms to irregular surfaces to maximise contact area, and it is easy to trim to the required size for specific installations.

Suitable for

• CPU heat spreaders and integrated cooling solutions
• GPU modules and graphics card components
• RAM modules and small memory chips
• SSD controllers and storage devices
• LEDs and other small electronic components requiring thermal transfer

Key specifications

• Model: Akasa AK-TT140-01
• Dimensions: 70 mm x 20 mm x 1 mm
• Material: Ceramic-filled silicone
• Operating temperature range: -40 °C to 160 °C
• Electrical behaviour: Non-conductive
• Colours: Blue, Green
• MPN: AK-TT140-01
• EAN: 4710679551302

How to use

Clean and dry the surfaces to be joined, removing dust, old thermal grease or debris. Cut the thermal pad to the required size and remove any protective film if present. Place the pad between the component and the heatsink, ensuring even coverage of the contact area. Reassemble the device and apply even mounting pressure so the pad conforms to surface irregularities and improves thermal contact.

Recommendations

For optimal performance, choose a pad thickness and size that provide full contact without excessive compression. Avoid stretching the pad when trimming, and replace the pad if it shows signs of deterioration or permanent deformation.