Pad térmico Rampage Termopad XTP-001 38×38×0,2 mm PTM

The Rampage Termopad XTP-001 is a high-performance thermal pad designed for efficient heat transfer between electronic components and heatsinks. With dimensions of 38×38 mm and a thickness of 0.2 mm, it is ideal for use with CPUs, GPUs, chipsets, memory modules, VRMs, and SSDs. The pad features a thermal conductivity of 12.8 W/mK, ensuring excellent thermal management. Made from a silicone-based compound, it is non-conductive and safe for use on sensitive electronics. The pad is non-adhesive and relies on compression-fit for installation, and it is reusable if undamaged. Operating temperature range from -40°C to 200°C. RoHS compliant.

Advantages

High thermal conductivity of 12.8 W/mK ensures efficient heat dissipation. Non-conductive material prevents short circuits. Reusable design reduces waste. Easy to install with no adhesive residue.

Suitable for

• CPU and GPU cooling
• Chipset and VRM thermal management
• Memory modules and SSD cooling

Key specifications

• Dimensions: 38 x 38 mm
• Thickness: 0.2 mm
• Thermal Conductivity: 12.8 W/mK
• Material: Silicone-based compound
• Colour: Grey
• Operating Temperature: -40°C to 200°C
• Quantity: 1 piece

Recommendations

For optimal performance, ensure the surfaces are clean and dry before installation. The pad should be compressed evenly for best thermal contact.