Placa de interface Intel X557T2OCPG1P5

Intel Ethernet Network Connection OCP X557-T2 (model X557T2OCPG1P5) is a dual-port 10Gb RJ45 internal interface card for servers. Designed for OCP PHY Mezzanine Type1/Type2 AIC compatibility, the module provides two 10Gb uplinks and two KR host connections through the OCP PHY mezzanine connector C. The card uses passive cooling and is available in black, green and grey finishes.

Advantages

The Intel X557T2OCPG1P5 delivers dual 10Gb RJ45 connectivity in an OCP form factor, enabling high-bandwidth uplinks and direct KR host links for compatible server platforms. Passive cooling reduces moving parts and maintenance, while OCP PHY Mezzanine compatibility allows flexible integration with Type 1 and Type 2 AIC mezzanine options.

Suitable for

• Server uplink aggregation and high-throughput networking
• Data center racks using OCP PHY Mezzanine Type1/Type2 AIC
• Environments requiring 10Gb RJ45 connectivity with KR host links

Key specifications

• Model: X557T2OCPG1P5 (Intel X557-T2)
• Form factor: OCP mezzanine module
• Ports: 2 x 10Gb RJ45 uplinks
• Host connections: 2 x KR via OCP PHY Mezzanine Connector C
• Cooling: Passive
• Colour: Black, Green, Grey
• Brand: INTEL
• ECCN: 5A991
• EAN: 8592978106683

How to use

Install the Intel X557T2OCPG1P5 into a compatible OCP slot on the server that supports OCP PHY Mezzanine Connector C and the required Type1 or Type2 AIC interface. Ensure the server is powered down and follow the chassis manufacturer’s instructions for mezzanine card insertion. After physical installation, boot the server and verify that the operating system or firmware recognizes the dual 10Gb network ports; install or update drivers if required.

Recommendations

Use this OCP module in systems and racks that explicitly support OCP PHY Mezzanine Type1/Type2 AIC and Connector C. For optimal reliability, pair with appropriate cabling, ensure adequate chassis airflow despite passive cooling, and keep firmware and drivers up to date.