DIMM 32 GB DDR5-6000 (2x 16 GB) kit duplo, memória RAM preta, CTCED532G6000HC30DC01, T-CREATE EXPERT, AMD EXPO

The Team Group T-CREATE EXPERT DDR5 32GB 6000MHz (CTCED532G6000HC30DC01) is a high-performance desktop memory module designed for creators and professionals. With a single 32 GB DDR5 module operating at 6000 MHz and a CAS latency of 30, it offers large capacity and fast data transfer in a 288-pin DIMM form factor. The module features a one-piece cooling assembly with vent holes, thermally conductive silicone, an aluminum heat spreader and high-temperature resistant capacitors to maintain stable operation under heavy workloads.

Advantages

The T-CREATE EXPERT DDR5 provides improved stability and compatibility through a 10-layer PCB with isolated power (Power layer) and ground (GND layer) planes that reduce interference. High-quality ICs, thermal materials and an aluminum heat spreader help sustain performance when processing large files or running multiple professional applications. The module is tested for compatibility with major motherboard manufacturers.

Suitable for

• Workstations and professional desktops
• Content creation: video editing, 3D rendering, graphics work
• Data analysis and large dataset processing
• Multitasking and running multiple professional applications

Key specifications

• Capacity: 32 GB (single module)
• Memory type: DDR5
• Speed: 6000 MHz
• CAS Latency: CL30
• Form factor: 288-pin DIMM
• Voltage: 1.35 V
• Colour: Black
• Manufacturer part number (MPN): CTCED532G6000HC30DC01

How to use

Install the 288-pin DIMM into a compatible motherboard slot while the system is powered off and unplugged. Consult the motherboard manual for the correct DIMM slot population and dual-channel or quad-channel configurations. After installation, verify BIOS/UEFI settings to ensure the module runs at the intended JEDEC or XMP/EXPO profile if supported by the motherboard.

Recommendations

For optimal stability in professional workflows, use matched modules in recommended slot configurations, update the motherboard BIOS to the latest version, and ensure adequate case airflow to assist the module’s cooling components.