Thermal Grizzly Minus Pad 8 - 120 x 20 x 2,0 mm, pack de 2 - Almofada térmica de alto desempenho

PC builders and overclockers often face the challenge of bridging uneven gaps between heat-generating components and their coolers. The Thermal Grizzly Minus Pad 8 solves this with a 2-pack of precisely dimensioned thermal pads, each measuring 120 x 20 x 2.0 mm. With a thermal conductivity of 8 W/mK, these pads efficiently transfer heat from CPUs, GPUs, VRMs, and memory modules to heatsinks, ensuring stable temperatures even under heavy loads.

Key specifications

• Thermal conductivity: 8 W/mK
• Pad dimensions: 120 mm length x 20 mm width x 2.0 mm thickness
• Quantity: 2 pads per pack
• Material: Silicone-based, naturally tacky, non-adhesive
• Operating temperature range: -100 °C to 250 °C
• Hardness: 35 Shore 00
• Electrical conductivity: No (non-conductive)
• Density: 3.6 g/cm³
• Volume resistance: 1 x 10^12 Ohm-cm
• Breakdown voltage: 10 kV/mm
• Colour: Grey
• Compliance: RoHS

Why choose it

These pads offer a perfect balance of high thermal performance and ease of use. The naturally tacky surface ensures secure placement without the mess of adhesives, and the pads can be repositioned or reused if needed. The 2.0 mm thickness is ideal for filling larger gaps, while the 35 Shore 00 hardness provides excellent conformability to uneven surfaces.

Ideal use cases

• Cooling high-performance CPUs and GPUs in gaming rigs and workstations
• Replacing worn-out thermal pads on graphics cards and motherboards
• Improving heat dissipation on VRM modules and memory chips
• Applications requiring a non-conductive thermal interface with high thermal conductivity

Good to know

The pads are RoHS compliant and can be cut to size for custom applications. They are non-curing and remain flexible over time, ensuring long-term reliability. Store them in a cool, dry place away from direct sunlight.