Conta Contactos
O seu carrinho
Envio por DPD e FedEx
Precisa de ajuda? Pergunte à IA

Almofada térmica DeLOCK 18469 3,2 W/m·K cinzento 20x120x1,5 mm

Almofada térmica DeLOCK 18469 3,2 W/m·K cinzento 20x120x1,5 mm
Almofada térmica DeLOCK 18469 3,2 W/m·K cinzento 20x120x1,5 mm
7,31 €
The DeLOCK 18469 thermal pad is a grey, silicone-based thermal interface material designed to improve heat dissipation for electronic components such as M.2 modules. With a thermal conductivity of 3.2 W/m·K and dimensions of 20 x 120 x 1.5 mm, the pad helps reduce operating temperatures and can cont... Ler mais
Stock 34 Código 1741805 Marca DELOCK Modelo 18469 Garantia 2 anos

Envios e devoluções

Entrega prevista Terça-feira, Outubro 20
Receberá atualizações através do nosso sistema de seguimento detalhado
Opções de pagamento
Cartão bancárioVisaMastercardPayPalApple PayGoogle PayTransferência bancária

The DeLOCK 18469 thermal pad is a grey, silicone-based thermal interface material designed to improve heat dissipation for electronic components such as M.2 modules. With a thermal conductivity of 3.2 W/m·K and dimensions of 20 x 120 x 1.5 mm, the pad helps reduce operating temperatures and can contribute to more stable performance and extended component lifespan. The pad is supplied in a polybag and manufactured in China/Taiwan.

Advantages

This thermal pad offers a thermal conductivity of 3.2 W/m·K for efficient heat transfer and comes in a slim 1.5 mm thickness suitable for compact assemblies. It features low oil bleeding, which minimises contamination of electronic contacts and preserves the pad’s thermal and mechanical properties over time to maintain even and stable heat dissipation.

Suitable for

  • Thermal management of M.2 SSD modules
  • Heat dissipation between chips and heatsinks in compact devices
  • Replacing or upgrading existing thermal pads in laptops, mini-PCs and embedded systems
  • Applications requiring a grey silicone thermal pad with low oil bleeding

Key specifications

  • Brand: DELOCK
  • Model / MPN: 18469
  • Thermal conductivity: 3.2 W/m·K
  • Dimensions (W x D x H): 20 x 120 x 1.5 mm
  • Colour: Grey
  • Packaging: Polybag
  • Origin: China / Taiwan
  • EAN: 4043619184699

How to use

Clean the contact surfaces thoroughly to remove dust, grease or old thermal material. Cut the DeLOCK thermal pad to the required size if necessary, peel off the protective liner and place the pad between the heat-generating component (for example an M.2 SSD) and the heatsink or metal cover. Apply gentle, even pressure to ensure full contact and avoid air gaps. Reassemble the device following the manufacturer’s instructions.

Recommendations

For optimal results, use the pad where a 1.5 mm thickness provides adequate contact pressure. Avoid stretching the pad during installation and keep it away from open flames or temperatures beyond the component manufacturer’s specified limits.
Destaques principais
  • Thermal management of M.2 SSD modules
  • Heat dissipation between chips and heatsinks in compact devices
  • Replacing or upgrading existing thermal pads in laptops, mini-PCs and embedded systems
  • Applications requiring a grey silicone thermal pad with low oil bleeding
  • Brand: DELOCK
  • Model / MPN: 18469
  • Thermal conductivity: 3.2 W/m·K
  • Dimensions (W x D x H): 20 x 120 x 1.5 mm
  • Colour: Grey
  • Packaging: Polybag
  • Origin: China / Taiwan
  • EAN: 4043619184699
Especificações
Altura
1.5 mm
Condutividade térmica
3.2 W/m·K
Cor do produto
Grey
Largura
20 mm
País de origem
China, Taiwan
Profundidade
120 mm
Quantidade por embalagem
1 pc(s)
Temperatura de funcionamento (T-T)
-60 - 180
Tipo
Thermal pad
Tipo de embalagem
Polybag

Folheto

Abrir documento
Histórico de preços nos últimos 6 meses
Almofada térmica DeLOCK 18469 3,2 W/m·K cinzento 20x120x1,5 mm
Atual
7,31 €
Mais baixo
6,56 €
Mais alto
7,31 €
Variação 24 h
+0,51 €   +7%
Semana
+0,49 €   +7%
Mês
+0,51 €   +7%

Produtos populares nesta categoria

Olá, sou o assistente de IA da DistriNode. Posso ajudá-lo a encontrar produtos, comparar opções, criar orçamentos em PDF ou abrir pedidos de suporte.