Thermal Pad Thermal Grizzly Minus Pad 8

The Thermal Grizzly Minus Pad 8 is a high-performance thermal pad made from a ceramic silicon complex and nano aluminum oxide, designed to provide reliable heat transfer between components. With a thermal conductivity of 8 W/m·K and an operating temperature range from -100 to 250 °C, this 120 × 20 × 0.5 mm pad compensates for small gaps while remaining electrically insulating and RoHS-compliant.

Advantages

The pad offers high thermal conductivity and high compressibility, enabling efficient contact with uneven surfaces. Its flexible and elastic surface conforms to component geometries with minimal pressure, and the material composition ensures stable, consistent heat transfer over a wide temperature range. The product is electrically insulating and eco-friendly.

Suitable for

• Thermal interface between CPUs, GPUs and heatsinks in computers and laptops
• Cooling gaps in power supplies, VRM modules and MOSFET assemblies
• Heat conduction for compact electronics, routers and embedded systems
• Prototyping and repairs where precise gap filling and electrical insulation are required

Key specifications

• Thermal conductivity: 8 W/m·K
• Dimensions: 120 mm × 20 mm × 0.5 mm
• Material: ceramic silicon complex with nano aluminum oxide (metal oxide and silicone based)
• Operating temperature: -100 to 250 °C
• Electrical insulation: yes
• Compliance: RoHS-compliant

How to use

Cut the Thermal Grizzly Minus Pad 8 to the required size if necessary, remove any protective film, and place the pad between the heat-generating component and the heatsink or chassis. Apply only light pressure to achieve optimal contact; the pad’s elasticity and compressibility allow it to adapt to surface irregularities. Ensure surfaces are clean and free of dust or grease before application.

Recommendations

For best results, use the pad on flat or gently curved contact surfaces and avoid overstretching. Replace the pad if it becomes damaged or contaminated. Not intended as an electrical conductor—maintain appropriate clearances for high-voltage applications.