Pad térmico ARCTIC TP-3 Premium Performance 100 x 100 mm, 0,5 mm

High Performance - very soft

Based on silicone and a special filler, TP-3 also outperforms high-performance pads, especially when height differences of closely spaced chips typically occur due to manufacturing tolerances. The TP-3 offers excellent thermal conductivity despite extremely low hardness.

Minimization of thermal resistance

The thinner the pad, the lower the termal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm and thus compensate for height differences between various components of up to 0.2 mm. Please note that due to the extremely low hardness, the installation of the 0.5 mm pad requires extra care. Please refer to the user manual.

Versatile Applications

Heat-conducting, vibration-damping, mouldable, electrically insulating - safe and easy to use. Thanks to its good compression properties, the soft heat conduction pad is particularly gentle on components and at the same time a good heat conductor. In addition to the standard format for M.2, the TP-3 is available in various sizes and thicknesses, which can be easily cut to the desired shape and size. This makes it ideal for RAMs, chipsets and ICs of all kinds, which are used in PCs, laptops, consoles, graphics cards and electronic devices in general.

Safe handling

The ARCTIC TP-3 is electrically insulating, non-adhesive and easy to handle. This means that optimal and safe heat transfer can be ensured in many application areas.

Bridging gaps

The TP-3 are softer than conventional pads and therefore particularly suitable for different chip heights and possible tolerances. Thanks to their good compressibility properties, the thermal pads act as the perfect gap filler and bridges uneven surface and air gaps without stressing sensitive and protruding components.

Available in different thicknesses and sizes

Our thermal pads are available in a choice of 0.5 mm, 1.0 mm and 1.5 mm. The 0.5 mm variant is ideally suited as an alternative to heat-conducting foil. The pads are available in different dimensions, depending on their thickness. If required, the pads can also be independently cut to any size.

How to use

For thermal compound, clean the contact surfaces thoroughly, apply a small amount of paste to the center of the component, then mount the heatsink and allow the compound to spread into a thin layer. For thermal pads, select the correct thickness and cut the pad to fit the contact area, then remove protective films and press firmly to ensure full contact. Follow manufacturer instructions for curing times if specified.

Recommendations

Use the MX thermal compound when minimal thermal resistance is required; choose thermal pads for quick installation or when component spacing requires fixed thickness. Store materials in a cool, dry place and replace compound or pads during major cooling system changes.